Rework Equipment×ケイ・オール - List of Manufacturers, Suppliers, Companies and Products

LGA implementation and rework

We propose proper implementation regarding LGA! We also accept rework tasks in case of defects.

At Kei All, we can utilize our achievements and experience with LGA just like we do with BGA, allowing us to perform removal, installation, replacement, and modification. However, BGA and LGA are similar yet distinct, and it is precisely because we understand the characteristics of LGA that we can carry out rework tasks. If you are experiencing issues such as "frequent shorts in LGA assembly" or "wanting to reball LGA to convert it to BGA," please feel free to consult with us. If you have any problems with LGA, we will resolve them using our past achievements and know-how. 【Features】 ■ Addressing various issues with reliable technology ■ Rework capability allows for recovery in case of emergencies ■ Comprehensive inspection, starting with the first board, followed by the assembly and rework of the remaining boards *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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BGA rework with underfill

Advanced rework technology! It prevents the concentration of stress that occurs on the connection surface of solder balls.

BGA is mounted on the printed circuit board by solder balls. Due to weak connection strength, there may be cases where the reliability of the connection cannot be maintained due to the detachment of the BGA or the occurrence of cracks at the solder joints in response to external stresses such as impact or bending. To address such issues and improve connection reliability, a sealing resin called underfill is used in the gap between the component and the board. 【Features】 ■ Uses a one-component heat-curing epoxy resin ■ Can reduce external stresses ■ Prevents concentration of stress at the connection surfaces of the solder balls ■ Widely used in mobile devices such as mobile phones and music players *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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POP implementation and rework

Proposal based on the concept of new POP implementation! It can reduce the package footprint after implementation.

POP (Package On Package) is a technology that increases integration density by stacking IC packages that were previously arranged in a two-dimensional layout on a circuit board. It is primarily used in industries that manufacture mobile devices such as mobile phones, portable music players, and car navigation systems, where high-density implementation is required. By adopting a stacked structure for the packages, it allows for the combination of packages with different functions. 【Features】 ■ Reduces the occupied area of the package after implementation ■ Enables the combination of packages with different functions by using a stacked structure ■ Minimizes wiring between packages, reducing the impact of reflections and noise, and our company also supports POP configurations with three or more layers *For more details, please refer to the PDF materials or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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Technical Document "Underfill BGA Rework Technology"

Can also cooperate in criminal investigations!

We can collaborate using underfill BGA rework technology. We can handle everything from the removal of underfill and coated components (such as BGA and CSP) to reballing, replacement, and reinstallation. The cured underfill material seals the BGA, significantly improving its strength compared to standard BGAs, and while its effectiveness is tremendous, the rework tasks such as removal or component replacement are more challenging than typical rework processes. At K-All, we have worked on methods and technical research to ensure that rework can be performed even on devices with various underfill materials applied. We can handle everything from component removal to reballing and replacement reinstallation. Rework and reballing are also possible for BGAs and CSPs that have undergone underfill and coating treatment. We can replace solder balls on BGAs and CSPs from lead-free to eutectic. We maintain over 5,000 types of masks for rework. ● For more details, please download the catalog or contact us.

Company：ケイ・オール
Price：Other

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High-Difficulty Implementation and Rework [Case Study Introduction]

Supports high-density, ultra-miniaturized components! Capable of handling high-difficulty assembly and rework.

At Kei All, we are capable of handling high-difficulty implementations and reworks. Recently, there has been a significant increase in components such as leads and thermal pads. These types of components can be very difficult to rework due to their shape and the configuration of the circuit board, as they tend to be less susceptible to heat. Rework technology is one of Kei All's proud strengths. We are continuously honing our skills to address high-difficulty components, which have been increasing in number due to the miniaturization and high density of parts. 【Features】 ○ Support for high-density, ultra-miniature components such as small camera modules and fine-pitch 0.3mm devices ○ Capability for high-difficulty implementations and reworks ○ Continuous technical training and skill development For more details, please contact us or download the catalog.

Company：ケイ・オール
Price：Other

Other contract services

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[Exchange/Installation/Removal] High-quality BGA rework

BGA exchange, installation, and removal services available! We have received voices of joy.

"BGA rework" refers to the process of partially heating BGA devices on completed circuit boards using specialized rework machines, tailored to specific needs. At K-All, we can handle both eutectic and lead-free soldering, and we have received positive feedback from many customers. We can perform work tailored to customer requests and the condition and symptoms of the circuit board. 【Features】 ■ Stable cleaning operations for circuit boards and removed devices ■ Cream solder supply (printing and coating) technology ■ Support for 0402 chips and micro-sized packages ■ Compatibility with large and multilayer circuit boards ■ Ability to accommodate a wide range of pitches, including special pitches *For more details, please refer to the PDF materials or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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High difficulty implementation and rework.

Supports high-density and ultra-miniaturized components such as fine pitch 0.3mm devices!

Rework technology is a point of pride for K-Oll. We are continuously honing our skills to handle high-difficulty components, which have seen an increase in implementation due to the miniaturization and high density of parts in recent years. This service is aimed at those who have concerns such as "I want to remove it, but the difficulty is high, and I am looking for a company that can rework high-difficulty components." 【Examples】 ■ I selected a BGA with a narrow pitch but am struggling to implement it. ■ A prototype board for SMT products with shield terminals (CN/LGA) is not functioning at all, and I want to replace the CN and reuse the LGA. *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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Rework Equipment×ケイ・オール - List of Manufacturers, Suppliers, Companies and Products

Rework Equipment Product List

LGA implementation and rework

BGA rework with underfill

POP implementation and rework

Technical Document "Underfill BGA Rework Technology"

High-Difficulty Implementation and Rework [Case Study Introduction]

[Exchange/Installation/Removal] High-quality BGA rework

High difficulty implementation and rework.